Reaction device, heat-insulating container, fuel cell device, and electronic apparatus

ABSTRACT

Disclosed is a reaction device that includes a reaction device main body that includes a first reaction unit and a second reaction unit, a container to house the reaction device main body and a first region that corresponds to at least the first reaction unit and a second region that corresponds to the second reaction unit, the first and second regions being provided to the container or internal side of the container. The first reaction unit is set to a temperature higher than that of the second reaction unit, and the first region has a higher reflectivity than that of the second region, with respect to a heat ray that is radiated from the reaction device main body.

This application is a Divisional Application of U.S. application Ser.No. 11/646,030, filed Dec. 27, 2006, now U.S. Pat. No. 7,811,341 whichis based upon and claims the benefit of priority from prior JapanesePatent Applications No. 2005-378549 and No. 2005-378505, filed on Dec.28, 2005, and Japanese Patent Application No. 2006-338222, filed on Dec.15, 2006, the entire contents of all of which are incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a reaction device and a heat-insulatingcontainer, in particular, to a reaction device that integrates reactorsrequiring different operation temperatures such as a vaporizer, areformer, a carbon monoxide remover, and the like that are used for afuel cell device, to a heat-insulating container that houses reactorsrequiring different operation temperatures, and power generation deviceand electronic apparatus provided with the power generation device thatincludes the reaction device or the heat-insulating container.

2. Description of the Related Art

Recently, as a power source that is clean and has high energy conversionefficiency, fuel cell that uses hydrogen as fuel is coming inapplication to car vehicles, portable devices, and the like. Fuel cellis a device that makes fuel and oxygen in the atmosphere reactelectro-chemically, and generates electric energy from chemical energydirectly.

As for fuel used in fuel cell, hydrogen can be mentioned. However, sincehydrogen is in a gaseous state at ambient temperature, there is aproblem concerning its handling and storage. In a case where liquid fuelsuch as alcohols and gasoline are used, a vaporizer to vaporize theliquid fuel, a reformer to take out hydrogen necessary for electricpower generation by making the liquid fuel and high temperature watervapor go through a reforming reaction, a carbon monoxide remover toremove carbon monoxide which is a by-product of reforming reaction, andthe like becomes in need.

SUMMARY OF THE INVENTION

Concerning such fuel cell device that reforms liquid fuel, whileoperation temperature of the vaporizer and the carbon monoxide removeris approximately 100 degrees Celsius to 180 degrees Celsius for example,the operation temperature of the reformer is approximately 300 degreesCelsius to 400 degrees Celsius for example. Thus, the difference inoperation temperature is large. However, it was difficult to maintaintemperature difference in the reaction device, since heat of thereformer propagates and temperature of the vaporizer and the carbonmonoxide remover increases.

Therefore, a principal object of the present invention is to provide aheat-insulating container and a reaction device that are able tomaintain temperature difference between reaction units in the reactiondevice that comprises two or more reaction units, and a fuel cell deviceand electronic apparatus that utilize the reaction device.

According to a first aspect of the present invention, there is provideda reaction device, comprising:

a reaction device main body that includes a first reaction unit and asecond reaction unit;

a container to house the reaction device main body; and

a first region that corresponds to at least the first reaction unit anda second region that corresponds to the second reaction unit, the firstand second regions being provided to the container or internal side ofthe container; wherein

the first reaction unit is set to a temperature higher than that of thesecond reaction unit, and

the first region has a higher reflectivity than that of the secondregion, with respect to heat ray that is radiated from the reactiondevice main body.

According to a second aspect of the present invention, there is provideda reaction device, comprising:

a reaction device main body that includes a first reaction unit and asecond reaction unit that have different temperatures from each other,the first reaction unit having a higher temperature than that of thesecond reaction unit;

a container to house the reaction device main body;

a first heat reflective film that is provided to an internal surface ofthe container and has a higher heat ray reflectivity than that of thecontainer; and

a second heat reflective film that is provided to a region, the regionbeing internal side with respect to the first heat reflective film andcorresponding to the first reaction unit, and the second heat reflectivefilm having a higher heat ray reflectivity than that of the container.

According to a third aspect of the present invention, there is provideda reaction device, comprising:

a reaction device main body to perform reaction of reaction material;and

a heat reflective film, provided so as to be opposed to an externalsurface of the reaction device main body, to reflect heat ray that isradiated from the reaction device main body,

wherein a heat releasing portion, which transmits or absorbs at least apart of the heat ray that is radiated from the reaction device mainbody, is provided to the heat reflective film.

According to a fourth aspect of the present invention, there is provideda heat-insulating container, comprising:

a container to house a reaction device main body that includes a firstreaction unit and a second reaction unit that have differenttemperatures from each other; and

a first region and a second region, that have different heat rayreflectivity from each other, and are provided to the container orinternal side of the container, wherein

the first reaction unit has a higher temperature than that of the secondreaction unit,

the first region has a higher reflectivity than that of the secondregion, with respect to heat ray that is radiated from the reactiondevice main body,

the first region is provided in correspondence with at least the firstreaction unit, and

the second region is provided in correspondence with the second reactionunit.

According to a fifth aspect of the present invention, there is provideda fuel cell device, comprising:

a reaction device main body that includes a first reaction unit and asecond reaction unit;

a container to house the reaction device main body;

a first region that corresponds to at least the first reaction unit anda second region that corresponds to the second reaction unit, the firstand second regions being provided to the container or internal side ofthe container; and

a fuel cell that generates power by fuel generated by the reactiondevice main body; wherein

the first reaction unit is set to a higher temperature than that of thesecond reaction unit, and

the first region has a higher reflectivity than that of the secondregion, with respect to heat ray that is radiated from the reactiondevice main body.

According to a sixth aspect of the present invention, there is providedan electronic apparatus, comprising:

a reaction device main body that includes a first reaction unit and asecond reaction unit;

a container to house the reaction device main body;

a first region that corresponds to at least the first reaction unit anda second region that corresponds to the second reaction unit, the firstand second regions being provided to the container or internal side ofthe container;

a fuel cell that generates power by fuel generated by the reactiondevice main body; and

an electronic apparatus main body that performs by electricity generatedby the power generation cell, wherein

the first reaction unit is set to a higher temperature than that of thesecond reaction unit, and

the first region has a higher reflectivity than that of the secondregion, with respect to heat ray that is radiated from the reactiondevice main body.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and further objects, features and advantages of the presentinvention will become more apparent from the following detaileddescription taken in conjunction with the accompanying drawings,wherein:

FIG. 1 is a block diagram of fuel cell device 1 according to a firstembodiment of the present invention;

FIG. 2 is a cross-sectional view of a reaction device 10 according tothe first embodiment of the present invention;

FIG. 3 is a graph showing a relation among reflectivity, area, and heatloss by emission of radiation from heat releasing portion 40;

FIG. 4 is a frame format showing a relation among infrared rays thatenter, are reflected by, and are transmitted in heat absorbing film 32b;

FIG. 5 is a graph showing relation between t and I(t)/(I−R);

FIG. 6 is a graph showing a relation between wavelength of black-bodyradiation and energy density of radiation;

FIG. 7 is a graph showing reflectivity with respect to wavelength, forAu, Al, Ag, Cu, and Rh;

FIG. 8 is a graph showing result of measuring absorption coefficientwith respect to Ta—Si—O—N type film;

FIG. 9 is a cross-sectional view showing a modification example of theheat-insulating container 30;

FIG. 10 is a cross-sectional view showing a modification example of theheat-insulating container 30;

FIG. 11 is a cross-sectional view showing a modification example of theheat-insulating container 30;

FIG. 12 is a cross-sectional view showing (a comparative example of) amodification example of the heat-insulating container 30;

FIG. 13 is a cross-sectional view showing a modification example of theheat-insulating container 30;

FIG. 14 is a frame format showing shapes of heat releasing portions 40through 43;

FIG. 15 is a frame format showing shapes of the heat releasing portions40 through 43;

FIG. 16 is a frame format showing shapes of the heat releasing portions40 through 43;

FIG. 17 is a frame format showing shapes of the heat releasing portions40 through 43;

FIG. 18 is a frame format showing shapes of the heat releasing portions40 through 43;

FIG. 19 is a block diagram showing a fuel cell device 101 according to asecond embodiment of the present invention;

FIG. 20 is a perspective view showing a reaction device 110 according tothe second embodiment of the present invention;

FIG. 21 is a cross-sectional view of FIG. 20 corresponding to lineXXI-XXI, when seen from the direction indicated by the arrow;

FIG. 22 is an exploded perspective view of the reaction device 110according to the second embodiment of the present invention;

FIG. 23 is a plan view of a first substrate 300;

FIG. 24 is a plan view of a second substrate 400;

FIG. 25 is a plan view of a third substrate 500;

FIG. 26 is a plan view of a fourth substrate 600;

FIG. 27 is a plan view of a fifth substrate 700;

FIG. 28 is a view showing a shape of an opening of a heat reflectivefilm;

FIG. 29 is a view showing another example of a shape of an opening of aheat reflective film;

FIG. 30 is a view showing another example of a shape of an opening of aheat reflective film;

FIG. 31 is a view showing another example of a shape of an opening of aheat reflective film;

FIG. 32 is a view showing another example of a shape of an opening of aheat reflective film;

FIG. 33 is a perspective view showing an example of another structure ofa reaction device according to the second embodiment;

FIG. 34 is a perspective view showing an example of another structure ofa reaction device according to the second embodiment when observed fromopposite direction with respect to FIG. 33;

FIG. 35 is a cross-sectional view of FIG. 33 corresponding to lineXXXV-XXXV, when seen from the direction indicated by the arrow;

FIG. 36 is a perspective view showing an application example of the fuelcell devices 1, 101 according to the embodiment of the presentinvention; and

FIG. 37 is a perspective view showing an example of electronic apparatus851 that uses the fuel cell devices 1, 101 as a power source.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, preferred embodiments concerning the present invention willbe described with reference to the drawings. The embodiments givenhereinafter have various kinds of technically preferred limitations tocarry out the embodiments, the scope of the present invention is notlimited to the given embodiments nor the figures given as an example,though.

First Embodiment

FIG. 1 is a block diagram of a fuel cell device 1 which is preferablyapplied with the present invention. The fuel cell device 1 is providedto a lap-top personal computer, a mobile phone, a personal digitalassistant (PDA), an electronic notebook, a wrist watch, a digital stillcamera, a digital video camera, a game apparatus, an amusementapparatus, an electronic calculator, and other kinds of electronicapparatuses, and is used as a power source to operate electronicapparatus main body.

The fuel cell device 1 is provided with a fuel container 2, a reactiondevice 10, and a fuel cell 3. As described later, in a case where thereaction device 10 and the fuel cell 3 are housed in the electronicapparatus main body, the fuel container 2 is provided to the electronicapparatus main body detachably, and the fuel container 2 is attached tothe electronic apparatus main body, the fuel and water in the fuelcontainer 2 may be supplied to the reaction device 10 by a pump.

The fuel container 2 stores fuel and water, and supplies solutionmixture of the fuel and water to the reaction device 10 by a micro pumpnot shown. As for the fuel that is stored in the fuel container 2,liquid fuel of hydrocarbon type can be applied. In particular, alcoholssuch as methanol and ethanol, ethers such as dimethyl ether, andgasoline can be mentioned. In the fuel container 2, fuel and water maybe stored separately, or may be stored as a mixture.

Here, the following explanation will be given for the case wheremethanol is used as fuel. However, other compounds may be used.

The reaction device 10 comprises a reaction device main body 20 and aheat-insulating container 30, in which the reaction device main body 20is housed.

The reaction device main body 20 includes a first reaction unit 11 and asecond reaction unit 12. The first reaction unit 11 includes a reformer60, a catalytic combustor 80, and a high-temperature heater not shown.The second reaction unit 12 comprises a vaporizer 50, a carbon monoxideremover 70, and a low-temperature heater not shown.

The vaporizer 50 vaporizes fuel and water supplied from the fuelcontainer 2. The reformer 60 reforms the vaporized fuel and water vaporsupplied from the vaporizer 50, through a reforming reaction with acatalyst, and generates gaseous mixture that includes hydrogen. (Here inFIG. 1, a structure in which the vaporizer 50 is arranged inside theheat-insulating container 30 is shown. However, it may be a structure inwhich the vaporizer 50 is arranged at outside the heat-insulatingcontainer 30.) In a case where methanol is used as the fuel, gaseousmixture of hydrogen gas and carbon dioxide gas as main product and smallamount of carbon monoxide gas as by-product is generated through areforming reaction as given in the following reaction equations (1) and(2).

To the carbon monoxide remover 70, in addition to the gaseous mixturesupplied from the reformer 60, air is supplied. The carbon monoxideremover 70 removes the carbon monoxide included in the gaseous mixture,by selectively oxidizing the carbon monoxide through a carbon monoxideremoving reaction as given in the reaction equation (3) with a catalyst.Hereinafter, gaseous mixture that is removed of the carbon monoxide isreferred to as reformed gas.CH₃OH+H₂O→3H₂+CO₂  (1)H₂+CO₂H₂O→CO  (2)2CO+O₂→2CO₂  (3)

The fuel cell 3 generates electric energy by electrochemical reaction ofhydrogen contained in the reformed gas. The fuel cell 3 is provided withan anode that supports catalytic particles, a cathode that supportscatalytic particles, and a solid polyelectrolyte film arranged inbetween the anode and the cathode, that are not shown. To the anode sideof the fuel cell 3, reformed gas is supplied from the carbon monoxideremover 70. Hydrogen gas contained in the reformed gas is separated intohydrogen ions and electrons by the catalyst (catalytic particles)provided on the anode, as given in electrochemical reaction equation(4). Hydrogen ions move toward the cathode side by going throughelectrolyte film, and electrons move to the anode through an externalcircuit. At the cathode side, water is generated through a chemicalreaction by the hydrogen ions that go through the electrolyte film, theelectrons that are supplied from the cathode through the externalcircuit, and oxygen gas supplied from external atmosphere, as given inelectrochemical reaction equation (5). Electric energy can be taken frompotential difference between the anode and the cathode.H₂→2H⁺+2e ⁻  (4)2H⁺+2e ⁻+½O₂→H₂O  (5)

Gaseous mixture that includes hydrogen gas that is left un-reacted bythe aforementioned electrochemical reaction equation (4) at the anodeside (hereinafter referred to as off-gas) is supplied to catalyticcombustor 80.

The catalytic combustor 80 combines oxygen to fuel and water suppliedfrom the fuel container 2, or to the off-gas, and performs combustion toheat the first reaction unit 11 to 250 degrees Celsius or higher (firsttemperature), for example approximately 250 degrees Celsius to 400degrees Celsius. The high-temperature heater heats the first reactionunit 11 instead of the catalytic combustor 80 at start-up, and thelow-temperature heater heats the second reaction unit 12 toapproximately 110 degrees Celsius to 190 degrees Celsius (secondtemperature) at start-up.

FIG. 2 is a cross-sectional view of reaction device 10 according to thefirst embodiment of the present invention.

The first reaction unit 11 and the second reaction unit 12 are housed inheat-insulating container 30 described later. In between the firstreaction unit 11 and the second reaction unit 12, pipe 21 that serves asflow passage of reaction material(reactant) and productmaterial(product) is provided (refer to FIG. 2). In addition, pipe 22 tolet the reaction material flow in from external of the heat-insulatingcontainer 30, and to let product material flow out of theheat-insulating container 30, is provided to the second reaction unit 12(refer to FIG. 2).

The first reaction unit 11, the second reaction unit 12, and the pipes21 and 22 may be formed by attaching together metal plates such asstainless steel (SUS 304), Kovar alloy, and the like. Alternatively,they may be formed by attaching together glass substrate and the like.

Next, the heat-insulating container 30 that house the reaction devicemain body 20 is described. The heat-insulating container 30 has arectangular solid shape, and the first reaction unit 11 and the secondreaction unit 12 are housed inside. The first reaction unit 11 and thesecond reaction unit 12 are connected through the pipe 21. The firstreaction unit 11 and the second reaction unit 12 are fixed by the pipe22 that penetrates through the heat-insulating container 30.

Package 31 of the heat-insulating container 30 can be formed byattaching together metal plates such as stainless steel (SUS 304), Kovaralloy, and the like, or glass substrates and the like. Internal space ofthe heat-insulating container 30 is kept at low pressure (0.03 Pa orlower) to prevent thermal conduction and convective flow by gasmolecules.

In addition, to the surface of internal wall of the package 31, a heatreflective film 32 a to reflect infrared ray (heat ray) is formed tosuppress heat loss from the reaction device main body 20 due toradiation. As for the heat reflective film 32 a, as shown in FIG. 7described later, metal with high reflectivity with respect to infraredray, such as gold (Au), aluminum, silver, or copper, can be used forexample. The heat reflective film 32 a can be formed by forming a metalfilm using a gas phase method such as sputter method, vacuum depositionmethod, and the like. Here, in a case where the heat reflective film 32a is formed with gold, a base layer of chromium or titanium may beformed as an adhesive layer.

Accordingly, heat loss from the reaction device main body 20 to theexternal of the heat-insulating container 30 can be suppressed.

Heat is conducted from the first reaction unit 11 to the second reactionunit 12 through the pipe 21. Therefore, in a case where the amount ofheat conducted from the first reaction unit 11 to the second reactionunit 12 through the pipe 21 exceeds the amount of heat conducted to theheat-insulating container 30 through the pipe 22, there is a fear inthat temperature of the second reaction unit 12 rises to a highertemperature than a suitable temperature. Thus, to the surface ofinternal wall of the heat-insulating container 30 according to thepresent embodiment, a heat releasing portion 40 is provided to a portionthat corresponds to the second reaction unit.

The heat releasing portion 40 is a region that has high absorbing ratewith respect to infrared ray, compared to other region of the surface ofthe internal wall of the package 31. Thus, the heat releasing portion 40absorbs infrared ray radiated from the second reaction unit 12 and letsit go under thermal conduction to the heat-insulating container 30.Accordingly, amount of heat that is released from the second reactionunit 12 by radiation (heat leakage) is enhanced, and temperatureincrease of the second reaction unit 12 can be suppressed.

The heat releasing portion 40 is, as shown in FIG. 2 for example, formedby providing a heat absorbing film 32 b that absorbs infrared ray, tothe internal side of the heat reflective film 32 a that is opposed tothe surface of the external wall where pipes 21 and 22 of the secondreaction unit 12 are not provided.

Hereinafter, materials used as the heat absorbing film 32 b, its filmthickness, and the like are studied.

[1] Study on Reflectivity

First of all, reflectivity of the heat releasing portion 40 is studied.

FIG. 3 is a graph showing a relation between area of the heat releasingportion 40 and its heat leakage (calculated value), when reflectivity ofthe heat releasing portion 40 is varied by 10% from 10% to 90% (Graphsfor 20% through 90% are calculated in accordance with the value of thegraph for 10%.). Here, it is assumed that the absorption coefficient ofthe heat absorbing film 32 b is large enough, and there is no infraredray that is transmitted through the heat absorbing film 32 b, isreflected by the base material or the heat reflective film 32 a, and istransmitted through the heat absorbing film 32 b again to re-enter theheat-insulating container 30.

Here, the size of the second reaction unit 12 is set to 1.0 cm×2.5cm×0.3 cm, and the distance between the second reaction unit 12 and theheat-insulating container 30 is set to 0.5 cm. Further, influx of heatfrom the pipe 21 and efflux of heat from the pipe 22 are both set to0.90 W, and the initial temperature of the second reaction unit 12 wasset to 120 degrees Celsius.

The heat loss from the heat releasing portion 40 by emission ofradiation varies by the reflectivity of the heat releasing portion 40and is proportional to the area of the heat releasing portion 40.Therefore, by setting the reflectivity and the area suitably withrespect to the heat loss from the heat releasing portion by emission ofradiation, temperature distribution of the reaction device main body 20can be made to a desired state.

For example, it can be obtained that, in a case where the reflectivityof the heat releasing portion 40 is 10%, and when the area of the heatreleasing portion 40 is 4.0 cm², heat leakage is approximately 0.35 W,and the temperature of the second reaction unit 12 lowers byapproximately 40 degrees Celsius and becomes approximately 80 degreesCelsius.

The heat releasing portion 40 is formed in a rectangle shape in thepresent embodiment, and the area of the heat releasing portion 40 is thesame as the area that corresponds to the second reaction unit 12, forexample.

[2] Study on Absorption Coefficient and Film Thickness

Next, absorption coefficient and film thickness of the heat absorbingfilm 32 b, in a case where the heat absorbing film 32 b is applied tothe base material of the package 31 or to the heat reflective film 32 aas the heat releasing portion 40, are studied.

FIG. 4 is a frame format showing a relation among infrared rays thatenter, are reflected by, and are transmitted in heat absorbing film 32b.

Here, as shown in FIG. 4, by expressing the intensity of the infraredray that enters the heat absorbing film 32 b as I, the intensity of theinfrared ray that is reflected at the surface of the heat absorbing film32 b as R, the absorption coefficient of the heat absorbing film 32 b asa, and the distance (depth) from the surface of the heat absorbing film32 b as t, the intensity of the infrared ray that is transmitted throughthe heat absorbing film 32 b at the location of distance (depth) t,I(t), can be expressed by the following equation.I(t)=(I−R)exp(−αt)

FIG. 5 shows a relation between t and I(t)/(I−R) (=exp(−αt)), when α isvaried as 10000/cm, 30000/cm, 60000/cm, and 100000/cm.

When α is 100000/cm and t is approximately 230 nm, the intensity of theinfrared ray that is transmitted through the heat absorbing film 32 b isless than 10%. That is, when αt is more than approximately 2.3, theintensity of the infrared ray that is transmitted through the heatabsorbing film 32 b becomes less than 10%, and the infrared ray that isfurther reflected by the base material or the heat reflective film 32 aand is transmitted through the heat absorbing film 32 b again tore-enter the heat-insulating container 30 becomes less than 1%.Therefore, a film with film thickness T that meets the condition ofαT>approximately 2.3 is suitable for the heat absorbing film 32 b.

On the other hand, when α is 100000/cm and t is 25 nm, that is, when αtis 0.25, the intensity of the infrared ray that is transmitted throughthe heat absorbing film 32 b becomes approximately 78%, and the infraredray that is further reflected by the base material or the heatreflective film 32 a and is transmitted through the heat absorbing film32 b to re-enter the heat-insulating container 30 becomes approximately61%. Thus, it is not suitable for the heat absorbing film 32 b.

[3] Study on Radiation Wavelength

Next, wavelength of black-body radiation that is radiated from thereaction device main body 20 is studied. FIG. 6 is a graph showingrelation between the wavelength of black-body radiation and energydensity of radiation, at temperatures of 300 K (27 degrees Celsius), 600K (327 degrees Celsius), and 900 K (627 degrees Celsius). It becameobvious that at 600 K, energy density of radiation becomes high withwavelength of 2 μm or more (0.6 eV or less), and at 900 K, energydensity of radiation becomes high with wavelength of 1.24 μm or more (1eV or less). Therefore, it is required that reflectivity of the heatreleasing portion 40 is low for infrared ray with wavelength of 1.24 μmor more.

[4] Study on Metal Material and Half-metallic Material

Metal materials and half-metallic materials have high reflectivity ingeneral. However, the absorption coefficient at most wavelengths is10⁵/cm or more. Therefore, it can be considered as a candidate for theheat absorbing film 32 b, by making the film thickness to 230 nm.Accordingly, reflectivity of metal materials and half-metallic materialsare studied.

FIG. 7 shows reflectivity with respect to wavelength for Au, Al, Ag, Cu,and Rh. Among these, reflectivity of Rh is comparatively low in theregion with wavelength of 1.24 μm or more, thus Rh can be considered asa candidate for the heat absorbing film 32 b.

Other than Rh, as for metal that have low reflectivity at wavelength of1.24 μm, Fe (reflectivity 75%), Co (reflectivity 78%), Pt (reflectivity78%), Cr (reflectivity 63%), and the like can be mentioned as acandidate for the heat absorbing film 32 b.

In addition, as for half-metallic material with low reflectivity,graphite (layered carbon) can be mentioned. Reflectivity of graphite isas low as 42% with wavelength of 1.24 μm, and 47% with wavelength of 2μm. Thus, it can be used as a material of the heat absorbing film 32 b.Further, carbon material that is called activated carbon is poor incrystallization property, and its layer structure is disordered.However, this may also be a candidate as a material for the heatabsorbing film 32 b.

Here, regarding any metal films among Au, Al, Ag, and Cu, reflectivityof infrared ray (wavelength of 5 to 30 μm) that is generated in thetemperature region of several hundred degrees Celsius, which is theoperation temperature of the first reaction unit 11, is approximately100%. Therefore, any metal film among Au, Al, Ag, and Cu is suitable forthe heat reflecting film 32 a.

[5] Study on Non-Metallic Material

Many of semiconductors have reflectivity ranging in 10% to 20% or less,in the region of wavelength with 1.24 μm or more. Therefore, it may beconsidered as a suitable material for the heat absorbing film 32 b.However, in most cases, absorption coefficient is extremely small asless than 1/cm.

However, amorphous semiconductor that has dangling bond has highabsorption coefficient, and thus can be considered to be capable ofbeing used as a material for the heat absorbing film 32 b. For example,with respect to amorphous silicon that has a large number of danglingbonds, absorption coefficient becomes 1000/cm or larger, thus amorphoussilicon can be used as a material for the heat absorbing film 32 b.

In addition, as an amorphous semiconductor material that is moresuitable for the heat absorbing film 32 b, film of Ta—Si—O—N type can bementioned. FIG. 8 shows a result of measuring absorption coefficient(cm⁻¹) for 0.5 to 3.5 eV (wavelength of approximately 2.48 μm to 350 nm)with respect to film of Ta—Si—O—N type, with resistance of 1.0 mΩ·cm and5.5 mΩ·cm. As for the film with resistance of 1.0 mΩ·cm, absorptioncoefficient in this measurement range is approximately 100000/cm ormore, thus the film with resistance of 1.0 mΩ·cm can be used as amaterial for the heat absorbing film 32 b.

Further, the applicant has found that film of Ta—Si—O—N type with moleratio in the range of approximately 0.6<Si/Ta<approximately 1.0 andapproximately 0.15<N/O<approximately 4.1 has absorption coefficient ofapproximately 100000/cm or more when resistance is 2.5 mΩ·cm or less.Therefore, the above material can also be used as a material for theheat absorbing film 32 b.

As described, according to the present embodiment, heat release from thereaction unit with lower temperature is enhanced, and difference intemperatures between the reaction units of the reaction devicecomprising two or more reaction units can be maintained.

Modification Example 1

In the aforementioned embodiment, heat releasing portion 40 was providedby setting a heat absorbing film 32 b on the heat reflective film 32 a.However, as shown in FIG. 9, an opening portion, where base material ofthe heat-insulating container is exposed, may be formed by not providingthe heat reflective film 32 a to a portion of a surface of internal wallof the package 31. The opening portion works as the heat releasingportion 41. In this case, the reflectivity of the opening portion is thereflectivity of the package 31.

Here, in a case where the package 31 is a glass substrate, most of theinfrared ray is transmitted through the package 31. Therefore,reflectivity of the opening portion becomes relatively lower compared tothat of the portion where the package 31 overlaps with the heatreflective film 32 a, where it is not the opening portion.

Modification Example 2

Alternatively, as shown in FIG. 10, the heat absorbing film 32 b may beprovided to the entire surface of the internal wall of the package 31,and the heat reflective film 32 a may be provided on the heat absorbingfilm 32 b with some exceptional portion, thus opening portion where theheat absorbing film 32 b is exposed may becomes the heat releasingportion 42.

Modification Example 3

In addition, as shown in FIG. 11, the heat absorbing film 32 b may bepartly provided to a surface of the internal wall of the package 31, andthe heat reflective film 32 a may be provided to the other portion ofthe surface of the internal wall of the heat-insulating container. Thusopening portion where the heat absorbing film 32 b is exposed works theheat releasing portion 43. Here, the periphery of the heat absorbingfilm 32 b and the heat reflective film 32 a may overlap partially.

Modification Example 4

When the reaction temperature of the reaction device main body 20exceeds 600 degrees Celsius, increase of energy density of radiationbecomes prominent (refer to FIG. 6). Therefore, single layer of the heatreflective film 32 a becomes insufficient, thus a structure with doublelayer is considered. That is, as shown in FIG. 12, a second heatreflective film 34 is provided by opening a gap 33 on the inner side ofthe external heat reflective film 32 a. The gap 33 is formed by asupporting member 36 comprising the same material as the package 31, forexample. By opening the gap 33, thermal conduction from the second heatreflective film 34 to the first heat reflective film 32 a can beprevented, thus thermal insulation efficiency can be improved.

In this case, as shown in FIG. 13, heat releasing window 35 may beprovided to a portion of the second heat reflective film 34, where itcorresponds to the second reaction unit 12. With the heat releasingwindow 35 provided, emission of radiation from the second reaction unit12 is prevented only by the external heat reflective film 32 a.Therefore, heat release from the second reaction unit 12 can be enhancedcompared to the first reaction unit 11, from which radiation isprevented by double layers of heat reflective films 32 a and 34.

Modification Example 5

In the aforementioned embodiment, heat releasing portions of 40 through43 were provided to the surface of the internal wall of the package 31,which is opposed to the surface of the external wall of the secondreaction unit 12 where pipes 21 and 22 are not provided. And, heat lossby emission of radiation from the second reaction unit 12 may beadjusted by regulating area of the heat releasing portions of 40 through43.

Here, supposing that the shape of the heat releasing portions 40 through43, which is opposed to a surface of the external wall of the secondreaction unit 12 where pipes 21 and 22 are not provided, can be made soas to have the same area as the second reaction unit 12 (FIG. 14),temperature of the second reaction unit 12 can be made uniform. However,in a case where shape or size is different (for example, FIG. 15),temperature of the second reaction unit 12 becomes uneven. Here, regionshown by solid line in FIG. 14 and range shown by two-dot chain line inFIGS. 15 through 18 are the shape that is opposed to and is the samewith the surface of the external wall of the second reaction unit 12.

In order to decrease the area of the heat releasing portions 40 through43 and also keep the temperature of the second reaction unit 12 uniform,it is preferable to provide the heat releasing portions 40 through 43 inthe region, in a uniformly dispersed manner. For example, the heatreleasing portions 40 through 43 may be provided in a stripe shape (FIG.16), in a checker board shape (FIG. 17), or the like.

In addition, temperature of the second reaction unit 12 tends to be highin the side where pipe 21 that conducts heat from the first reactionunit 11 is provided, and tends to be low in the side where pipe 22 thatconducts heat to the heat-insulating container 30 is provided.Therefore, as shown in FIG. 18 for example, heat releasing portions 40through 43 may be provided so that the distribution of the heatreleasing portions 40 through 43 is larger on the side where pipe 21 isprovided (left side in FIG. 18), and the distribution of the heatreleasing portions 40 through 43 is smaller on the side where pipe 22 isprovided (right side in FIG. 18). By providing the heat releasingportions 40 through 43 in such manner, amount of heat release of thehigher-temperature side where pipe 21 is provided, is larger. And amountof heat release of the lower-temperature side where pipe 22 is providedis smaller. As a result, temperature gradient can be suppressed.

Second Embodiment

Next, second embodiment according to the present invention is described.

FIG. 19 is a block diagram showing an outline structure of fuel celldevice 101 that is applied with the reaction device of the presentembodiment according to the present invention. As shown in the figure,the fuel cell device 101 is provided with a fuel container 102, avaporizer 150, a reaction device 110, and a fuel cell 103.

Though it is not shown in figure, the vaporizer 150 has a structure inwhich two substrates are attached, and to at least one attaching surfaceof these substrates, that is, to the inner surface, a micro flow passageis formed in a zigzag manner. Further, to the external surface of eachsubstrate, a thin film heater comprising an electrical heating materialsuch as heat-generating resister, heat-generating semiconductor thatgenerates heat by being applied with voltage, is provided. By this thinfilm heater, fuel and water that are supplied from the fuel container102 to the micro flow passage in the vaporizer 150 are heated andvaporized.

The reaction device 110 generates hydrogen from vaporized fuel and watervapor supplied from the vaporizer 150, and comprises a reformer 160, acarbon monoxide remover 170, a reaction device main body 120 providedwith a catalytic combustor 180, and a heat-insulating container 130.With respect to the performance of the reformer 160, the carbon monoxideremover 170, the catalytic combustor 180, and the heat-insulatingcontainer 130, they are the same as the reformer 60, the carbon monoxideremover 70, the catalytic combustor 80, and the heat-insulatingcontainer 30 of the first embodiment. Therefore, explanation will beomitted.

Detail on the aforementioned reaction device 110 will be provided later.The reaction device 110 is a device that has the reformer 160, thecarbon monoxide remover 170, the catalytic combustor 180, and theheat-insulating container 130 integrated together. Combustion heatgenerated at the catalytic combustor 180 is supplied to the reformer160, and thus the reformer 160 is set to a predetermined temperature(first temperature). Carbon monoxide remover 170 is set to apredetermined temperature (second temperature) that is lower than thetemperature of the reformer 160, by thermal conduction throughconnection portion 121 (described later) that connects the reformer 160and the carbon monoxide remover 170. Accordingly, chemical reactions ofthe aforementioned chemical reaction equations (1) through (3) areperformed. Here, a structure in which another vaporizer that is notshown is arranged in between the fuel container 102 and the catalyticcombustor 180, a part of the fuel is vaporized by this vaporizer, andthen supplied to the catalytic combustor 180, may be further provided.

As for the performance of the fuel cell 103, since it is the same withthe fuel cell 3 of the first embodiment, explanation is omitted.

The aforementioned fuel cell device 101 is, in a similar manner as thefuel cell device 1 of the first embodiment, provided to a lap-toppersonal computer, a mobile phone, a personal digital assistant (PDA),an electronic notebook, a wrist watch, a digital still camera, a digitalvideo camera, a game apparatus, an amusement apparatus, an electroniccalculator, and other kinds of electronic apparatuses, and is used as apower source to operate electronic apparatus main body. Here, in a casewhere the reaction device 110, the vaporizer 150, and the fuel cell 103of the fuel cell device 101 are housed in the electronic apparatus mainbody, the fuel container 102 is provided to the electronic apparatusmain body detachably, and the fuel container 102 is attached to theelectronic apparatus main body, the fuel and water in the fuel container102 may be supplied to the reaction device 110 by a pump.

Next, structure of the reaction device 110 is described in more detail.FIG. 20 is a perspective view showing the reaction device 110 accordingto the present embodiment, FIG. 21 is a cross-sectional view of FIG. 20corresponding to line XXI-XXI, when seen from the direction indicated bythe arrow, FIG. 22 is an exploded perspective view of the reactiondevice 110 according to the present embodiment, and FIGS. 23 through 27are plan views of a first substrate 300 through a fifth substrate 700.

Here, in the following description, the upper surface of FIG. 20 isreferred to as front surface, and lower surface is referred to as backsurface. Further, with respect to FIG. 22 and FIGS. 23 through 27mentioned later, groove portions (flow passages) 406 and 408, grooveportions (flow passages) 506 and 508, groove portions (flow passages)606 and the like are shown in a simplified manner.

As shown in FIGS. 20 through 22, the reaction device 110 is formed as aflat plate that is structured by laminating a plurality of substrates300, 400, 500, 600, and 700. A reaction device main body 120 is providedinside the reaction device 110.

This reaction device main body 120 is, as shown in FIG. 21, providedwith a reforming reaction room 161 of the reformer 160, a carbonmonoxide removing flow passage 171 of the carbon monoxide remover 170, acombustion reaction room 181 of the catalytic combustor 180, aconnection portion 121 to connect the reformer 160 and the carbonmonoxide remover 170, and a supporting portion 122, in its internal.

The reforming reaction room 161 is a room (flow passage) to perform theaforementioned reforming reaction, and supports reforming catalyst 165on its internal wall surface to generate hydrogen from hydrocarbons suchas methanol, and water. This reforming catalyst 165 is a catalyst ofcopper/zinc oxide type for example, and has copper/zinc oxide supportedon alumina as the supporter.

In addition, the carbon monoxide removing flow passage 171 is a room(flow passage) to perform the aforementioned carbon monoxide removingreaction, and supports carbon monoxide removing catalyst 175 on itsinternal wall surface to oxidize small amount of carbon monoxidegenerated as by-product, other than hydrogen and the like, by thereforming catalyst 165, and thus generate carbon dioxide. This carbonmonoxide removing catalyst 175 is a catalyst of platinum/alumina typefor example, and has platinum, or platinum and ruthenium, supported onalumina.

The combustion room 181 is a room (flow passage) to perform theaforementioned combustion reaction, and supports combustion catalyst 185such as platinum type catalyst on its internal wall surface to performcombustion reaction efficiently. This combustion reaction room 181 is aheating unit in the present invention, and supplies heat to thereforming reaction room 161 and the like.

The aforementioned reaction device main body 120 is arranged inside theheat-insulating container 130 by the supporting portion 122. Theheat-insulating container 130 surrounds the reaction device main body120 and transmits at least a part of heat ray (infrared ray) that isradiated from the reaction device main body 120. The reaction devicemain body 120 is housed in a sealed chamber 139, which is inside theheat-insulating container 130. The sealed chamber 139 is in a vacuumcondition of 10 Pa or lower, preferably 1 Pa or lower.

To the internal surface of the package 131 of the heat-insulatingcontainer 130, a heat reflective film 132 a is provided to prevent heatfrom releasing by reflecting heat ray, which is radiated from thereaction device main body 120 side, back to the reaction device mainbody 120 side. The heat reflective film 132 a is provided so as to beopposed to the external surface of the reaction device main body 120.This heat reflective film 132 a is formed by making a metal film ofgold, aluminum, silver, copper, and the like, using a gas phase methodsuch as sputter method, vacuum deposition method, and the like.

In the present embodiment, as shown in FIGS. 21 and 22, the heatreflective film 132 a is partly provided with an opening portion 141.Since the internal heat of the reaction device main body 120 is releasedto the external through this opening portion 141, the temperature of thereaction device main body 120 is adjusted to a desired state. In thepresent embodiment, the opening portion 141 is provided to a region thatcorresponds to a part of the reaction device main body 120, that is, tofront and back both sides of the region that corresponds to the carbonmonoxide remover 170. Therefore, temperature of the carbon monoxideremover 170 side can be lowered with respect to the temperature of thereformer 160 side, and thus a desirable temperature difference can beprovided. Here, the opening portion 141 is not limited to be provided tothe front and back both sides of the region that corresponds to thecarbon monoxide remover 170, and it may be provided to either one sideof the front side or the back side. Here, in the aforementioneddescription, the opening portion 141 is formed in a form of a hole asshown in FIG. 22. However, it is not limited to such form, and it may beformed in a form in which the heat reflective film 132 a is divided inmidway. That is, it may be any form so long as a region without the heatreflective film 132 a is provided in order to keep the temperature ofthe reaction device main body 120 to a desired state.

As shown in FIGS. 21 and 22, the supporting portion 122 supports thereaction device main body 120 by connecting the heat-insulatingcontainer 130 and one end portion of the reaction device main body 120,more precisely the end portion that is closer to the carbon monoxideremoving flow passage 171 than the reforming reaction room 161. Thus,the heat-insulating container 130 and the reaction device main body 120are made integral.

To this supporting portion 122, supply and discharge portion 123 (referto FIG. 20 and FIGS. 24 through 26 described later) is provided tosupply reaction material used for the reforming reaction, the carbonmonoxide removing reaction, and the combustion reaction that areperformed at the reaction device main body 120, from the external to thereaction device main body 120. The supply and discharge portion 123 alsodischarges the product material generated by these reactions to theexternal.

As shown in FIG. 20, the supply and discharge portion 123 includes afuel supplying port 123 a, a fuel oxygen supplying port 123 b, an oxygenauxiliary supplying port 123 c, a product discharging port 123 d, areactant supplying port 123 e, and a fuel discharging port 123 f, thatopen at the external surface of the heat-insulating container 130.

The fuel supplying port 123 a lets off-gas that includes hydrogen usedfor combustion at the catalytic combustor 180, methanol as a fuel forcombustion, and the like flow inside. The fuel oxygen supplying port 123b lets oxygen used for combustion at the catalytic combustor 180, flowinside. Here, to each of the fuel supplying port 123 a and the fueloxygen supplying port 123 b, a pump device (not shown) to feed the fueland the like with pressure are connected.

The oxygen auxiliary supplying port 123 c lets oxygen to selectivelyoxidize carbon monoxide at the carbon monoxide remover 170 flow inside.

The product discharging port 123 d discharges the gaseous mixture thatmainly contains hydrogen, which is generated by the aforementionedreforming reaction and the carbon monoxide removing reaction, and isconnected to the anode of the fuel cell 103. The reactant supplying port123 e lets hydrocarbons such as methanol and the like, and water, whichare to be reformed into hydrogen at the reformer 160, flow inside, andis connected from the vaporizer 150.

The fuel discharging port 123 f discharges carbon dioxide and watergenerated by the combustion at the catalytic combustor 180.

As shown in FIG. 22, the aforementioned reaction device 110 is formed bylaminating and attaching the first substrate 300, the second substrate400, the third substrate 500, the fourth substrate 600, and the fifthsubstrate 700 in this order. That is, the back surface of the firstsubstrate 300 and the front surface of the second substrate 400 areattached, the back surface of the second substrate 400 and the frontsurface of the third substrate 500 are attached, the back surface of thethird substrate 500 and the front surface of the fourth substrate 600are attached, and the back surface of the fourth substrate 600 and thefront surface of the fifth substrate 700 are attached.

Here, in the present embodiment, the first substrate 300 through thefifth substrate 700 are glass substrates. More precisely, they are glasssubstrates that contain Na, Li, and the like that can serve as movableions, and each substrate is attached with each other by anodic bondingand the like for example. As for such glass substrate, it is preferableto use Pyrex (registered trademark) for example.

The first substrate 300 through the fifth substrate 700 have asubstantially rectangular shape when observed in plan view, anddimension along the outer border is approximately the same. Further, atleast part of side surface of the substrates are mount flush with eachother.

Next, description on each substrate 300, 400, 500, 60, and 700 will begiven.

[First Substrate]

As shown in FIG. 23, to the back surface side of the first substrate300, that is, to the side that is opposed to the front surface of thesecond substrate 400, a rectangular shaped concave portion 301 isformed. To the internal surface of the concave portion 301, theaforementioned heat reflective film 132 a is provided, and an openingportion 141 is provided to the heat reflective film 132 a. The firstsubstrate 300 thus forms upper side portion of the package 131, withrespect to the heat-insulating container 130.

[Second Substrate]

As shown in FIG. 24, the second substrate 400 has a triangular shapedcutout portion 440 at the corner portion of one end portion (end portionof left side in figure). To the second substrate 400, a hole 401 thatpenetrates through the front and back surface is provided. The hole 401is formed in a substantially C-shape, along the periphery of the secondsubstrate 400. That is, the hole 401 is provided along the periphery ofthe second substrate 400, except for the region where it is thesupporting portion 122 of the second substrate 400. The internal portionsurrounded by the hole 401 serves as the main body 410 which becomes thereaction device main body 120, and the portion divided to the externalside of the main body 410 by the hole 401 serves as the frame unit 420which becomes the package 131.

To the internal periphery surface of the hole 401, the aforementionedheat reflective film 132 a is provided.

To the central portion of the main body 410, a rectangular hole 402 isformed. To the internal periphery surface of the hole 402, a radiationpreventing film (not shown) that has heat-insulating property may beprovided. Here, the radiation preventing film is formed by metal such asaluminum and the like, for example.

As shown in FIG. 21, to the front surface of the second substrate 400,that is, to the surface that is opposed to the concave portion 301 ofthe first substrate 300, and where it also corresponds to the carbonmonoxide remover 170 for example, a getter 403 may be provided. Thegetter 403 is activated by being heated, and adsorbs gas and fineparticles in its surroundings. Thus, the getter 403 adsorbs gas thatexists in the sealed chamber 139 of the reaction device 110, andimproves or maintains degree of vacuum of the sealed chamber 139. As formaterial used for the getter 403, metal alloy that includes zirconium,barium, titanium, or vanadium as main component, can be mentioned. Here,an electric heater such as electric heating material and the like toheat and activate the getter 403 may be provided to the getter 403, andelectric cable of the electric heater may be pulled out to the externalof the heat-insulating container 130. Further, it is preferable toprovide the getter 403 at a location where the temperature of the getter403 does not exceed the activation temperature during performance of thereaction device 110.

To the back surface of the second substrate 400, that is, to theattaching surface with the third substrate 500, groove portion 406,groove portion 407 a and 407 b, groove portion 408, and groove portions409 a through 409 f are formed. The groove portion 406 is provided in aregion, with respect to the main body 410, that is opposed to thesupporting portion 122 with respect to the hole 402. The groove portion406 is formed in a zigzag manner for example. To the internal wallsurface of the groove portion 406, the aforementioned reforming catalyst165 (refer to FIG. 21) is supported.

The groove portion 407 a is provided in a region from the end portion ofthe groove 406, to the supporting portion 122 side with respect to thehole 402, within the main body 410. The groove portion 407 b is providedfrom the end portion of the groove portion 406 to the groove portion408.

The groove portion 408 is provided in a region, with respect to the mainbody 410, that is in the same side with the supporting portion 122 withrespect to the hole 402 (the other end side, which is on the oppositeside of the one end portion side). The groove portion 408 is formed in azigzag manner for example. To the internal wall surface of the grooveportion 408, the aforementioned carbon monoxide removing catalyst 175(refer to FIG. 21) is supported.

The groove portions 409 a through 409 f are provided in order at thesame side with the supporting portion 122 (the other end portion, whichis on the opposite side of the one end portion,) of the second substrate400. One end portion of the groove portions 409 a through 409 f areopened to the side surface of the other end portion side of the secondsubstrate 400, and the other end portions are blocked.

[Third Substrate]

As shown in FIG. 25, the third substrate 500 has cutout portions 540 and541, and cutout portions 509 a through 509 f. The cutout portions 540and 541 are provided in a triangle shape in the two corner portions ofone end portion of the third substrate 500 (end portion of left side infigure).

The cutout portions 509 a through 509 f are provided in order at endportion of the supporting portion 122 side of the third substrate 500,in a state that they correspond to the groove portions 409 a through 409f of the second substrate 400. When the second substrate 400 is layeredwith the third substrate 500, the cutout portions 509 a through 509 fare opposed to the groove portions 409 a through 409 f respectively.Among these, cutout portions 509 a, 509 b, and 509 f are provided sothat one end portions of them are opened to the side surface of theother end portion side of the third substrate 500, and the other endportions of them are blocked. Further, the cutout portions 509 c and 509d are provided so that one end portions of them are opened to the sidesurface of the other end portion side of the third substrate 500, andthe other end portions of them are communicated with the groove 508described later. The cutout portion 509 e is provided so that one endportion of it is opened to the side surface of the other end portionside of the third substrate 500, and the other end portion of it iscommunicated with the groove 507 a described later.

To the third substrate 500, a hole 501 that penetrates through the frontand back surface is provided.

The hole 501 is formed in a substantially C-shape, along the peripheryof the third substrate 500. That is, the hole 501 is provided along theperiphery of the third substrate 500, except for the region where it isthe supporting portion 122 of the third substrate 500. The internalportion surrounded by the hole 501 serves as the main body 510 whichbecomes the reaction device main body 120, and the portion divided tothe external side of the main body 510 by the hole 501 serves as theframe unit 520 which becomes the package 131.

To the internal periphery surface of the hole 501, the aforementionedheat reflective film 132 a is provided.

To the central portion of the main body 510, a rectangular hole 502 isformed. These holes 501 and 502 correspond to the holes 401 and 402 ofthe second substrate 400 respectively, and when the second substrate 400and the third substrate 500 are layered, they are connected with theholes 401 and 402 respectively. To the internal periphery surface of thehole 502, a radiation preventing film (not shown) that hasheat-insulating property may be provided. Here, the radiation preventingfilm is formed by metal such as aluminum and the like, for example.

As shown in FIG. 21, to the back surface of the third substrate 500,that is, to the attaching surface with the fourth substrate 600, thinfilm heaters 505 a and 505 b as the heating unit of the presentinvention are provided in a zigzag manner for example. These thin filmheaters 505 a and 505 b are made of electrical heating material such asheat-generating resister or heat-generating semiconductor that generatesheat by being applied with voltage, and supplies heat to the reformingreaction room 161 and to the carbon monoxide removing flow passage 171respectively, at the time of start up, and set them to a predeterminedtemperature. To each of the thin film heaters 505 a and 505 b, electriccables 505 c and 505 d that conduct electricity between the internalside and the external side of the reaction device 110 are connectedrespectively. Here, as shown in FIG. 21, the thin film heaters 505 a and505 b may be provided only to the back surface of the third substrate500, or may be provided to both front and back surface. In a case whereit is also provided to the front surface, it is desirable to cover itwith a suitable protective film. Further, since it is preferable thatthe electric cable 505 c and 505 d are thin, Kovar cable was used as theelectric cables 505 c and 505 d in the present embodiment, and thediameter of the cable was set to 0.2 mm. However, as for the electriccables 505 c and 505 d, steel-nickel metal alloy cable, DUMET cable thathas core material of steel-nickel metal alloy coated with copper layermay also be used.

As shown in FIG. 25, to the front surface of the third substrate 500,that is, to the attaching surface with the second substrate 400, grooveportion 506, groove portions 507 a and 507 b, and groove portion 508 areformed. The groove portion 506 is provided in a region, with respect tothe main body 510, that is opposed to the supporting portion 122 withrespect to the hole 502. The groove portion 506 is formed in a zigzagmanner for example. To the internal wall surface of the groove portion506, the aforementioned reforming catalyst 165 (refer to FIG. 21) issupported. The groove portion 506 corresponds to the groove portion 406of the second substrate 400, and is opposed to the groove portion 406when the second substrate 400 and the third substrate 500 are layered.

The groove portion 507 a is provided from the end portion of the grooveportion 506 to the cutout portion 509 e. The groove portion 507 b isprovided from the end portion of the groove portion 506 to the grooveportion 508. These groove portions 507 a and 507 b correspond to thegroove portions 407 a and 407 b of the second substrate 400, and areopposed to the groove portions 407 a and 407 b respectively when thesecond substrate 400 and the third substrate 500 are layered.

The groove portion 508 is provided in a region, with respect to the mainbody 510, that is in the same side with the supporting portion 122 withrespect to the hole 502. The groove portion 508 is formed in a zigzagmanner for example. To the internal wall surface of the groove portion508, the aforementioned carbon monoxide removing catalyst 175 (refer toFIG. 21) is supported. The groove portion 508 corresponds to the grooveportion 408 of the second substrate 400, and is opposed to the grooveportion 408 when the second substrate 400 and the third substrate 500are layered.

[Fourth Substrate]

As shown in FIG. 26, the fourth substrate 600 has a triangle shapedcutout portions 640 and 641 at each corner portions of one end portion(end portion of left side in figure). To the fourth substrate 600, ahole 601 that penetrates through the front and back surface is provided.

The hole 601 is formed in a substantially C-shape, along the peripheryof the fourth substrate 600. That is, the hole 601 is provided along theperiphery of the fourth substrate 600, except for the region where it isthe supporting portion 122 of the fourth substrate 600.

The internal portion surrounded by the hole 601 serves as the main body610 which becomes the reaction device main body 120, and the portiondivided to the external side of the main body 610 by the hole 601 servesas the frame unit 620 which becomes the package 131.

To the internal periphery surface of the hole 601, the aforementionedheat reflective film 132 a is provided.

To the central portion of the main body 610, a rectangular hole 602 isformed.

Each of these holes 601 and 602 corresponds to the hole 501 and hole 502of the third substrate 500 respectively, and when the third substrate500 and the fourth substrate 600 are layered, they are connected withthe hole 501 and hole 502 respectively. To the internal peripherysurface of the hole 602, a radiation preventing film (not shown) thathas heat-insulating property may be provided. Here, the radiationpreventing film is formed by metal such as aluminum and the like, forexample.

To the front surface of the fourth substrate 600, that is, to theattaching surface with the third substrate 500, a groove portion 606,groove portions 607 a and 607 b, groove portions 609 a through 609 f,and conducting grooves 605 a and 605 b (refer to FIG. 21) are formed.

The groove portion 606 is provided in a region, with respect to the mainbody 610, that is opposed to the supporting portion 122 with respect tothe hole 602. The groove portion 606 is formed in a zigzag manner forexample. To the internal wall surface of the groove portion 606, theaforementioned reforming catalyst 165 (refer to FIG. 21) is supported.

The groove portions 607 a and 607 b are each provided from the endportion of the groove portion 606 to the region, which is in thesupporting portion 122 side with respect to the hole 602, within themain body 610.

The groove portions 609 a through 609 f are provided in order at the endportion of the supporting portion 122 side of the fourth substrate 600,in a state that they correspond to the cutout portions 509 a through 509f of the third substrate 500. The groove portions 609 a through 609 fare opposed to the cutout portions 509 a through 509 f respectively whenthe third substrate 500 and the fourth substrate 600 are layered. Amongthese, the groove portions 609 a and 609 b are provided so that one endportion of them are opened to the side surface of the other end portionside of the fourth substrate 600, and the other end portions of themjoin so as to be connected with the groove portion 607 b. Further, thegroove portions 609 c through 609 e are provided so that one end portionof them are opened to the side surface of the other end portion side ofthe fourth substrate 600, and the other end portions of them areblocked. The groove portion 609 f is provided so that one end portion ofit is opened to the side surface of the other end portion side of thefourth substrate 600, and the other end portion of it is communicatedwith the groove 607 a.

As shown in FIG. 21, the conducting grooves 605 a and 605 b are providedon a surface of the fourth substrate 600 that is opposed to the thirdsubstrate 500, and are located so as to correspond with the electriccables 505 c and 505 d respectively. The conducting groove 605 a letsthe electric cable 505 c go through, that is connected to the thin filmheater 505 a, and the conducting groove 605 b lets the electric cable505 d go through, that is connected to the thin film heater 505 b.

[Fifth Substrate]

As shown in FIG. 27, the fifth substrate 700 is formed in asubstantially symmetry manner with respect to the first substrate 300 inup and down direction, and has triangle shaped cutout portions 740through 742 at each corner portion of the end portion (end portion ofleft side in figure) and at a corner portion of the other end portion.To the front surface side of the fifth substrate 700, that is, to thesurface that is opposed to the back surface of the fourth substrate 600,a rectangular concave portion 701 is formed. To the internal surface ofthe concave portion 701, a heat reflective film 132 a that is the samewith the one provided to the internal surface of the concave portion 301of the first substrate 300 is provided, and an opening portion 141 isprovided to the heat reflective film 132 a.

The fifth substrate 700 forms the lower side portion of the package 131of the heat-insulating container 130.

By laminating and attaching the aforementioned first substrate 300, thesecond substrate 400, the third substrate 500, the fourth substrate 600,and the fifth substrate 700, the reaction device 110 is formed. Thus,the sealed chamber 139 is formed, and the heat-insulating container 130is formed at the outside of the sealed chamber 139, by the concaveportion 301, the holes 401, 402, 501, 502, 601, 602, and the concaveportion 701. Here, for descriptive purpose, a room formed by the concaveportion 301, the holes 401, 501, 601, and the concave portion 701 isreferred to as heat-insulating room 139 a, and a room formed by theholes 402, 502, and 602 is referred to as heat-insulating room 139 b(refer to FIG. 21).

Further, reforming reaction room 161 is formed by the groove portions406 and 506, flow passage 162 is formed by the groove portions 407 a and507 a, communication flow-passage 163 is formed by the groove portions407 b and 507 b, and carbon monoxide removing flow passage 171 is formedby the groove portion 408 and the groove portion 508.

Further, the combustion reaction room 181 and flow passages 182, 183 areformed by placing the third substrate 500 as a lid on the groove portion606 and the groove portions 607 a and 607 b.

In addition, the fuel supplying port 123 a, the fuel oxygen supplyingport 123 b, the oxygen auxiliary supplying port 123 c, the productdischarging port 123 d, the reactant supplying port 123 e, and the fueldischarging port 123 f of the supply and discharge portion 123 areformed by the groove portions 409 a through 409 f, the cutout portions509 a through 509 f, and the groove portions 609 a through 609 f.

Accordingly, the reactant supplying port 123 e is connected with thereforming reaction room 161 by the flow passage 162, the reformingreaction room 161 is connected with the carbon monoxide removing flowpassage 171 by the communication flow-passage 163, the carbon monoxideremoving flow passage 171 is connected with the oxygen auxiliarysupplying port 123 c and the product discharging port 123 d, the fuelsupplying port 123 a and the fuel oxygen supplying 123 b are connectedwith the combustion reaction room 181 by the flow passage 183, and thecombustion reaction room 181 is connected with the fuel discharging port123 f by the flow passage 182.

[Performance of the Fuel Cell Device]

Next, description on the performance of the fuel cell device 101 will begiven.

First of all, fuel (liquid fuel of hydrocarbons such as methanol and thelike, for example) and water are supplied from the fuel container 102 tothe vaporizer 150, and are vaporized at the vaporizer 150.

Next, when the gaseous mixture of fuel and water vapor that arevaporized at the vaporizer 150 flows into the reforming reaction room161 through the reactant supplying port 123 e of the supply anddischarge portion 123 and the flow passage 162, hydrogen and the likeare generated by the reforming catalyst 165.

Here, heat that is generated at the thin film heater 505, reaction heat(combustion heat) generated at the combustion reaction room 181, and thelike are supplied to the reforming reaction room 161. Further, heat raythat is radiated from the internal side to the external side of thereaction device main body 120 is reflected toward the internal by theheat reflective film 132 a of the first substrate 300 and the fifthsubstrate 700. As a result, temperature of the reforming reaction room161 becomes relatively high, and the reforming catalyst 165 is heated totemperatures in the range of 200 to 400 degrees Celsius, to thetemperature approximately 300 degrees Celsius in the present embodiment.

Here, the reforming reaction at the reforming reaction room 161 isconducted by steam reforming method in the present embodiment. However,it may also be conducted by partial oxidation reforming method.

Subsequently, the generated hydrogen and the like pass through thecommunication flow-passage 163, enter the carbon monoxide removing flowpassage 171, and are mixed with air that flows in from the oxygenauxiliary supplying port 123 c of the supply and discharge portion 123.Accordingly, carbon monoxide contained in the gaseous mixture isoxidized and removed by the carbon monoxide removing catalyst 175.

Here, the reformer 160 and the catalytic combustor 180 are physicallyconnected with the carbon monoxide remover 170 through the flow passageportion of the connection portion 121. However, a heat-insulating room139 b is provided in between the reformer 160 and the catalyticcombustor 180, and the carbon monoxide remover 170. Therefore,cross-sectional area of the connection portion 121 in between them isdecreased, and heat propagation from the reformer 160 and the catalyticcombustor 180 to the carbon monoxide remover 170 is suppressed.

On the other hand, internal heat of the reaction device main body 120 isreleased to the external through the opening portion 141 of the heatreflective film 132 a that is provided to the first substrate 300 andthe fifth substrate 700. Therefore, temperature of the carbon monoxideremover 170 decreases. As a result, a suitable temperature differencecan be provided in between the reformer 160 and the carbon monoxideremover 170.

Accordingly, the carbon monoxide remover 170 is set to a relatively lowtemperature compared to the reformer 160, and the carbon monoxideremoving catalyst 175 is set to temperature ranging from 120 to 200degrees Celsius, approximately 120 degrees Celsius in the presentembodiment.

Next, when air is supplied to the cathode of the fuel cell 103, andgaseous mixture of hydrogen and the like in the carbon monoxide removingflow passage 171 are supplied to anode of the fuel cell 103 through theproduct discharging port 123 d of the supply and discharge portion 123,electric energy is generated at the fuel cell 103.

Subsequently, gaseous mixture that include un-reacted hydrogen at theanode of the fuel cell 103 (off-gas) flows into the combustion reactionroom 181 through the fuel supplying port 123 a of the supply anddischarge portion 123 and through the flow passage 183, and air flowsfrom the external into the combustion reaction room 181 through the fueloxygen supplying port 123 b of the supply and discharge portion 123 andthrough the flow passage 183. Accordingly, hydrogen is combusted at thecombustion reaction room 181 to generate combustion heat, and productmaterial such as water and carbon dioxide are discharged to the externalfrom the fuel discharging port 123 f of the supply and discharge portion123, through the flow passage 182.

According to the aforementioned reaction device 110 of the fuel celldevice 101, the reformer 160 and the carbon monoxide remover 170 areprovided with the intermediary of the communication flow-passage 163 inbetween the second substrate 400 and the third substrate 500. Therefore,in contrast to the conventional case where the reformer 160 and thecarbon monoxide remover 170 are provided independently and are connectedwith a connection pipe and the like, the device as a whole can beminimized.

Further, internal heat of the reaction device main body 120 can be keptinside by the heat reflective film 132 a, and can be simultaneouslyreleased to the external through the opening portion 141 in the regionthat corresponds to the carbon monoxide remover 170. Therefore,temperature of the carbon monoxide remover 170 can be lowered and asuitable temperature distribution can be formed in the reaction devicemain body 120. As a result, even in a case where the reaction devicemain body 120 is minimized, and the reformer 160 and the carbon monoxideremover 170 are arranged at a relatively close range, the reformer 160and the carbon monoxide remover 170 can be each set to an optimumtemperature, and reaction can be conducted suitably at each of thereformer 160 and the carbon monoxide remover 170.

Further, the reformer 160 and the carbon monoxide remover 170 areprovided in a connected manner in the reaction device main body 120 bylaminating the first substrate 300 through the fifth substrate 700.Therefore, in contrast to a conventional case where the reformer 160 andthe carbon monoxide remover 170 are manufactured separately and areconnected with a connection pipe, the reaction device main body 120 canbe manufactured at one time. In addition, the reaction device main body120 and the heat-insulating container 130 are formed in an integratedmanner. Therefore, in contrast to a case where the reaction device mainbody 120 and the heat-insulating container 130 are manufacturedseparately and then the reaction device main body 120 is arranged insidethe heat-insulating container 130, the reaction device 110 ismanufactured at one time Accordingly, manufacturing step of the reactiondevice 110 can be reduced.

Further, in a case where a pipe that is connected to the reaction devicemain body 120 is inserted into the heat-insulating container 130, thereis a possibility that that gas leaks from the gap between theheat-insulating container 130 and the pipe. In contrast, according tothe reaction device 110, since the supply and discharge portion 123 andthe heat-insulating container 130 are provided in an integrated manner,the sealed space of the heat-insulating container 130 can be kept at ahigh sealed state. Thus, burden to keep the sealed state of the sealedspace can be simplified.

In addition, although the reaction device main body 120 isheat-insulated at vacuum pressure with the intermediary of the sealedspace of the sealed chamber 139 by the heat-insulating container 130,since the supporting portion 122 that is provided with the supply anddischarge portion 123 is connected to one end portion on the carbonmonoxide remover 170 side of the reaction device main body 120, theinternal heat of the reformer 160 and the carbon monoxide remover 170propagate from the one end portion to the heat-insulating container 130.However, since the portion where heat propagates from the reformer 160and the carbon monoxide remover 170 to the heat-insulating container 130are located together, and since the carbon monoxide remover flow passage171 is kept to a relatively low temperature with respect to the reformer160 as mentioned above, temperature difference with the heat-insulatingcontainer 130 is relatively small compared to the case where thereformer 160 side is connected to the heat-insulating container 130.Therefore, amount of heat that propagates to the heat-insulatingcontainer 130 through the supporting portion 122 can be kept relativelysmall. Further, concerning the supporting portion 122, since thetemperature difference between the carbon monoxide remover 170 at theone end portion side of the supporting portion 122 and theheat-insulating container 130 at the other end portion side isrelatively small, thermal stress that is applied to the supportingportion 122 can be kept relatively small, and thus damage of thesupporting portion 122 due to thermal stress can be suppressed.

In addition, since the heat-insulating room 139 b is provided in betweenthe reformer 160 and the carbon monoxide remover 170, cross-sectionalarea of a portion of the flow passage that connects the reformer 160 andthe carbon monoxide remover 170 can be suppressed. Therefore, amount ofheat that propagates from the reformer 160 and the catalytic combustor180 to the carbon monoxide remover 170 can be suppressed, and heat isreleased to the external through the opening 141 that is provided to theheat reflective film 132 a on the first substrate 300 and the fifthsubstrate 700. As a result, a suitable temperature difference can beprovided in between the reformer 160 and the carbon monoxide remover170, and thus even in a case where the reaction device main body 120 isminimized and the reformer 160 and the carbon monoxide remover 170 arearranged in a relatively close manner, the carbon monoxide remover 170can be set to a relatively low temperature.

Further, since the first substrate 300 through the fifth substrate 700are made of glass and the materials are all the same, whenperforming/terminating the reaction device 110, that is, duringtemperature increase/decrease of each substrate, thermal stress due tothe difference in amount of thermal expansion can be suppressed.Therefore, damage of the reaction device 110 due to the thermal stresscan be suppressed.

In addition, the getter 403 is located in a region where it correspondsto the carbon monoxide remover 170, in the internal surface of thesealed chamber 139. Therefore, in contrast to the case where the getter403 is located in a region where it corresponds to the reformer 160 orthe catalytic combustor 180, activation of the getter 403 duringperformance of the reaction device 110 can be prevented.

Here, in the aforementioned embodiment, a case where the opening portion141 of the heat reflective film 132 a is provided singly in arectangular shape was described. However, shape and number of theopening portion 141 is not limited to this embodiment. FIG. 28 throughFIG. 32 are figures that show examples of shape of the opening portionof the heat reflective film. Here, FIG. 28 shows a case of theaforementioned rectangular shape, for comparison. In this case, ratio ofthe area of the opening portion 141 to the projected area of the carbonmonoxide remover 170 (hereinafter referred to as opening ratio [%]) is100%. The opening portion 141 may be formed with shape and number asshown in FIG. 29 through FIG. 32 for example. As shown in theaforementioned FIG. 3, amount of heat that is released by radiation(heat loss by emission of radiation) from the opening portion 141 isproportional to the area of the opening portion 141. Therefore, theopening ratio of the opening portion 141 is set in accordance with thepreset temperature of the carbon monoxide remover 170. In a case wherethe opening ratio is set to approximately 50%, as shown by the openingportions 141 b and 141 e of FIG. 29 and FIG. 32, the opening portion 141may be provided in plural with a rectangular shape. In addition, asshown by the opening portion 141 c of FIG. 30, the opening portion 141may be provided in a triangle shape, so that the opening area becomeslarger as it becomes closer to the reforming reaction room 161 side,where the temperature becomes higher than that of the carbon monoxideremover 170, in order to make the temperature of the carbon monoxideremover 170 more uniform compared to the opening portion 141 shown inFIG. 28. Further, as shown by the opening portion 141 d of FIG. 31, theopening portion 141 may be provided in a trapezoid shape, so that thewidth of opening portion side at the connecting portion of the reformingreaction room 161 and the carbon monoxide remover 170 becomes small.Accordingly, temperature change at the connecting portion of thereforming reaction room 161 and the carbon monoxide remover 170 can bemade gradual compared to the opening portion 141 shown in FIG. 28, andthus generation of stress due to sharp temperature distribution can beprevented.

Further, a case where one reforming reaction room 161 and one carbonmonoxide removing flow passage 171 are each provided to the reactiondevice main body 120 was described. However, the reforming reaction room161 and the carbon monoxide removing flow passage 171 may be provided inplural, by manufacturing the reaction device main body 120 in alaminated manner, in which the second substrate 400 through the fourthsubstrate 600 are laminated in plural in this order in between the firstsubstrate 300 and the fifth substrate 700.

A case where all of the fist substrate 300 through the fifth substrate700 are made of glass was described. However, they may also be made ofceramic. Here, concerning prevention of thermal stress duringtemperature change due to the difference in thermal expansioncoefficient, it is preferable that the first substrate 300 through thefifth substrate 700 are formed by a same material.

A case where the supporting portion 122 to support the reaction devicemain body 120 is provided to the reaction device 110 only at the carbonmonoxide remover 170 side, and the supply and discharge portion 123 isprovided to the supporting portion 122 was described. However, thepresent invention is not limited to such embodiment.

FIG. 33 is a perspective view showing example of another structure ofthe reaction device according to the present embodiment, and FIG. 34 isa perspective view when seen from the opposite direction with respect toFIG. 33. FIG. 35 is a cross-sectional view of FIG. 33 corresponding toline XXXV-XXXV, when seen from the direction indicated by the arrow. Asshown in FIG. 33 through FIG. 35, the supporting portion 122 may beprovided not only at the carbon monoxide remover 170 side of thereaction device main body 120 but also to other portions, and supply anddischarge portion 123 may be provided to each supporting portion 122.That is, concerning the reaction device 110A shown in FIG. 33 throughFIG. 35, supporting portion 122A and 122A are each provided at thecarbon monoxide remover 170 side and the reformer 160 side of theheat-insulating container 130, and supply and discharge portion 123A isprovided to each of the supporting portion 122A and 122A in a separatedmanner. Here, the reaction device 110A can be formed by laminating aplurality of substrates 300A through 700A, in the same manner as theaforementioned embodiment. In this case, to the internal surface side ofthe substrates 300A and 700A that correspond to the first substrate 300and the fifth substrate 700, heat reflective film 132 a is provided in asimilar manner, and opening portion 141 is provided to the heatreflective film 132 a in a similar manner.

Further, a case where the internal space of the sealed chamber 139 is atvacuum pressure was described. However, it may be filled with rare gassuch as argon, helium, and the like.

Hereinafter, reaction device according to the present embodiment will bedescribed further specifically by giving examples and comparativeexamples.

As for an example of the reaction device 110 according to the presentembodiment, a reaction device 110 in which heat reflective film 132 a isprovided to the first substrate 300 and to the fifth substrate 700 bygold, aluminum, silver, or copper, was formed. The area of openingportion 141 of the heat reflective film 132 a was approximately 2.835cm² (=2.7 cm×1.05 cm), and area of the carbon monoxide remover 170 was3.645 cm² (=approximately 2.7 cm×1.35 cm). That is, the opening ratio ofthe opening portion 141 was 78%. The temperature of the reformer 160 was299 degrees Celsius, and the temperature of the carbon monoxide remover170 was 81 degrees Celsius, with respect to this reaction device mainbody 120.

Here, as for a comparative example of the present invention, a similarreaction device as the aforementioned embodiment, except that theopening portion 141 was not provided, was formed. The temperature of thereformer 160 was 303 degrees Celsius, and the temperature of the carbonmonoxide remover 170 was 132 degrees Celsius, with respect to thereaction device of this comparative example.

As described, concerning the reaction device main body 120 of theexample, temperature difference between the reformer and the carbonmonoxide remover can be made even larger, compared to the reactiondevice of the comparative example. Therefore, even when the connectionportion 121 is made short, temperature difference between the reformerand the carbon monoxide remover can be maintained, thus size of thereaction device main body 120 can be further minimized.

[Outline Structure of Fuel Cell Device]

Next, outline structure of the fuel cell device 1, 101 are described.FIG. 36 is a perspective view showing one example of fuel cell device 1,101. As shown in FIG. 36, the aforementioned reaction device 10, 110 canbe used in a state in which they are attached to fuel cell device 1,101. The fuel cell device 1, 101 is provided with, for example, a flame104; fuel container 2, 102 that are detachable to the flame 104; a flowamount control unit 105 that has a flow passage, a pump, a flow sensor,a bulb, and the like; a vaporizer 50, 150 not shown; reaction device 10,110; fuel cell 3, 103 not shown; a power generation module 106 that hasa humidifying apparatus to humidify the fuel cell 3, 103, a collectingcontainer to collect by-product generated at the fuel cell 3, 103, andthe like; air pump 107 to supply air (oxygen) to the reaction device 10,110 and the power generation module 106; a power source unit 108 thathas an external interface to electrically connect with external devicethat is driven by a secondary battery, a DC-DC converter, or fuel celldevice 1, 101; and the like. Gaseous mixture of water and fuel in thefuel container 2, 102 are supplied to the reaction device 10, 110 viathe vaporizer 50, 150, by the flow control unit 105. Accordingly,hydrogen gas is generated, hydrogen gas is supplied to the fuel cell 3,103 of the power generation module 106, and the generated electricity isstored in the secondary battery of the power source unit 108.

[Electronic Apparatus]

FIG. 37 is a perspective view showing one example of electronicapparatus 851 that uses the fuel cell device 1, 101 as a power source.As shown in FIG. 37, this electronic apparatus 851 is an electronicapparatus of mobile type, such as a laptop personal computer forexample. The electronic apparatus 851 has a lower package 854 that isembedded with a calculation processing circuit, structured with CPU,RAM, ROM, and other electronic parts, and is also provided with a keyboard 852. The electronic apparatus 851 also has an upper package 858that is provided with a liquid crystal display 856. The lower package854 and the upper package 858 are connected by a hinge, and arestructured so that the upper package 858 can be layered on the lowerpackage 854 to be folded in a state that the liquid display 856 isopposed to the key board 852. From the right side surface to the bottomsurface of the lower package 854, an attachment unit 860 is formed toattach the fuel cell device 1, 101. When the fuel cell device 1, 101 isattached to the attachment unit 860, the electronic apparatus 851performs by the electricity of the fuel cell device 1, 101.

Although various exemplary embodiments have been shown and described,the invention is not limited to the embodiments shown. Therefore, thescope of the invention is intended to be limited solely by the scope ofthe claims that follow.

1. A reaction device, comprising: a reaction device main body includinga first reaction unit which performs reaction of a first reactionmaterial, and a second reaction unit which performs reaction of a secondreaction material; a first heater which heats the first reaction unit ata first temperature; a second heater which heats the second reactionunit at a second temperature lower than the first temperature; a heatreflective film, provided so as to be opposed to an external surface ofthe reaction device main body, to reflect a heat ray that is radiatedfrom the reaction device main body; a heat releasing portion whichtransmits or absorbs at least a part of the heat ray radiated from thereaction device main body; and a container which houses the reactiondevice main body therein and has a lower heat ray reflectivity than aheat ray reflectivity of the heat reflective film, wherein the heatreflective film is provided on an internal wall surface of thecontainer, and wherein the heat reflective film includes: a firstportion which is exposed and which is opposed to the first reactionunit, and a second portion which is opposed to the second reaction unitand at which the heat releasing portion is provided.
 2. The reactiondevice as claimed in claim 1, wherein the heat reflective film consistsessentially of one of gold, aluminum, silver, and copper.
 3. Thereaction device as claimed in claim 1, wherein: the first reaction unitincludes a reformer which is supplied with a vaporized liquid fuel of ahydrocarbon type as the first reaction material and which generates gasincluding hydrogen as a product material from the first reactionmaterial, and the second reaction unit includes a carbon monoxideremover which is supplied with the product material as the secondreaction material and which removes carbon monoxide included in theproduct material.
 4. The reaction device as claimed in claim 1, wherein:the first reaction unit and the second reaction unit are separatelyarranged, and the reaction device main body is further provided with aconnection portion that connects the first reaction unit and the secondreaction unit.
 5. The reaction device as claimed in claim 4, wherein aheat-insulating room is provided in between the first reaction unit andthe second reaction unit.
 6. The reaction device as claimed in claim 4,wherein the second reaction unit is heated by the first heater throughthe connection portion.
 7. The reaction device as claimed in claim 1,wherein the container is made of glass.
 8. The reaction device asclaimed in claim 1, wherein an internal space of the container is atvacuum pressure.
 9. The reaction device as claimed in claim 1, furthercomprising a supporting portion to support the reaction device main bodyby connecting the reaction device main body and the container.
 10. Thereaction device as claimed in claim 9, wherein the supporting portion isprovided with a plurality of flow passages to supply reaction materialthat is used for reaction at the reaction device main body, from outsideof the container to the reaction device main body, and to dischargeproduct material that is generated by the reaction at the reactiondevice main body, to outside of the container.
 11. The reaction deviceas claimed in claim 9, wherein the supporting portion is provided at oneend portion at a second reaction unit side of the reaction device mainbody.
 12. The reaction device as claimed in claim 1, wherein at thesecond portion the heat reflective film is covered with a heat absorbingfilm to form the heat releasing portion.